1. The heatsink was cleaned with an oil based cleaner which filled the
microscopic gaps and contaminated the interface.
2. The existing thermal interface material was not completely removed. The
compound should be the only material between the heatsink and the CPU.
3. The heatsink was not installed properly.
4. The thermal compound was applied too thick.
5. The measurement is being taken on the cold side of the thermal junction or on
the side of the core where thermal compound squeezed from the junction
contaminates the probe. (Better compound then transfers more heat to the probe
so the temperature reads higher.)
6. The measurement probe moved when the chip was removed to clean off the
previous compound.
7. The compound was not allowed to go through its break-in period. (Minimum
25 hours. Can be 400+ hours.) Temperatures will drop 1C to 5C over this time.
8. The application was contaminated with an eyelash, a bit of dirt, fingerprint or
something else that spaced the heatsink away from the metal cap.
9. An unbalanced heatsink fan is causing excessive vibration and damaging the
interface layer.
10. An improperly manufactured or bent shim is interfering with proper contact
between the CPU core and the heatsink.
11. The heatsink fan was not plugged back in after the compound was changed.
12. The ambient temperature where the computer is located has changed. If the
room temperature changes, the CPU temperature will also change. It is important
to remember that cooling solutions keep the CPU X number of degrees above
ambient. So if the ambient temperature increases 3 degrees, the CPU temperature
will also increase 3 degrees.
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